Material :Carbide Substrate and Polycrystalline Diamond, Diamond Powder, Diamond grain and tungsten carbide, diamond layer+Tungsten carbide support, PCD+TC

Usage :Metalworking etc, Cutting tools, To cut stone or Metal cutting, For Making PCD Drill

Application :Cutting, For Non-ferrous Metal, Ceramic, Rough Machining, SIC

Diamond thickness :0.5-0.8mm

Diamond content :≥ 90%

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DM010S Sandwich PCD Cutting Tools Blank,For Drilling Application

Sandwich PCD is composed of PCD layer that is sandwiched by tungsten carbide layers in both(top & bottom) sides, the sintering technology is more strict and more difficult than normal type PCD, primarily used for drilling application.

PCD Grade	Grain Size	Diameter	Diamond layer thickness	Overall thickness
DM010S	10 μm	Φ 45 mm	0.5 mm	1.5/2.0/3.2 mm

Product Tags:

DM010S Sandwich PCD Blanks Diamond Content ≥90% For Drilling Application

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Thin PCD Cutting Tool Blanks

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Sandwich PCD Blanks

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CVD Single Crystalline Diamond

CVD Polycrystalline Diamond

DM010S Sandwich PCD Blanks Diamond Content ≥90% For Drilling Application

polycrystalline diamond pcd tools

rockwell hardness information

sds max point chisel